Bond Hitech-integration BO-01

Trading mode
Bond description
Hitech-integration BO-01
Emitent
Хайтэк-Интеграция
Status
not trading
Nominal volume
RUB 150,000,000
Placed volume
RUB 150,000,000
Date of listing
19.05.2022
Bond type
Exchange bonds
Maturity date
15.05.2025
Lot size
1 pcs.
Face value
RUB 1,000
Is substitute
No
Registration number
4B02-01-00072-L
ISIN code
RU000A104TM1
Reliability
Coupon payment schedule
Coupon #Date of paymentCoupon ratePayment amount% of face valueFace value
No results found.